Patent Assignment Details
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| Reel/Frame: | 005556/0827 | |
| Pages: | 2 |
| | Recorded: | 01/04/1991 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/07/1991
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Application #:
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07465861
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Filing Dt:
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01/16/1990
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Title:
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BIMETALLIC CIRCUIT BREAKER WITH INSULATED THERMAL ASSEMBLY
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Assignees
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| NO. 1760, HIGASHIMATANO-CHO, TOTSUKA-KU |
| YOKOHAMA-CITY, KANAGAWA-PREFECTURE, JAPAN |
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| NO. 41, HIGASHIMATANO-CHO, TOTSUKA-KU |
| YOKOHAMA-CITY, KANAGAWA-PREFECTURE, JAPAN |
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Correspondence name and address
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SUGHRUE, MION, ZINN,
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MACPEAK & SEAS
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2100 PENNSYLVANIA AVENUE, N.W.
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WASHINGTON, D.C. 20237-3202
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