Patent Assignment Details
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| Reel/Frame: | 005643/0001 | |
| Pages: | 2 |
| | Recorded: | 03/14/1991 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/04/1994
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Application #:
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07669526
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Filing Dt:
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03/14/1991
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Title:
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INSULATING FILM FORMING METHOD FOR SEMICONDUCTOR DEVICE INTERCONNECTION
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Assignee
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| 6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU |
| A CORP OF JAPAN |
| TOKYO, JAPAN |
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Correspondence name and address
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RICHARD J. MINNICH
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FAY, SHARPE, BEALL ET AL
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1100 SUPERIOR AVENUE
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SUITE 700
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CLEVELAND, OHIO 44114-2518
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