Patent Assignment Details
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| Reel/Frame: | 005740/0211 | |
| Pages: | 3 |
| | Recorded: | 06/06/1991 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/02/1993
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Application #:
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07711144
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Filing Dt:
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06/06/1991
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Title:
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SEMICONDUCTOR DEVICE HAVING MULTI-LAYERED WIRING, AND METHOD OF MANUFACTURING THE SAME
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Assignee
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| 72 HORIKAWA-CHO, SAIWAI-KU |
| KAWASAKI-SHI, JAPAN |
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Correspondence name and address
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FINNEGAN, HENDERSON, FARABOW
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GARRETT & DUNNER
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1300 I STREET, N.W.
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WASHINGTON, DC 20005-3315
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