Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 005751/0187 | |
| Pages: | 6 |
| | Recorded: | 06/14/1991 | | |
| Conveyance: | DOCUMENT FILED BY THE REGISTRAR OF THE COMPANY SHOWING A CHANGE OF ADDRESS -- EFFECTIVE 11/28/88 - TOKYO, JAPAN |
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Total properties:
10
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Patent #:
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Issue Dt:
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05/29/1990
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Application #:
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07328653
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Filing Dt:
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03/27/1989
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Title:
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SUPERCONDUCTOR CONTAINING INTERNAL STRESS ABSORBER
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Patent #:
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Issue Dt:
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10/22/1991
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Application #:
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07341190
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Filing Dt:
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04/21/1989
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Title:
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METHOD OF MAKING A SPUTTERING TARGET FOR A BISMUTH BASED SUPERCONDUCTOR
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Patent #:
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Issue Dt:
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06/23/1992
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Application #:
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07362466
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Filing Dt:
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05/30/1989
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Title:
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STRUCTURE OF SUPERCONDUCTIVE WIRING AND PROCESS OF FABRICATION THEREOF
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Patent #:
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Issue Dt:
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12/31/1991
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Application #:
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07363011
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Filing Dt:
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06/08/1989
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Title:
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SPUTTERING TARGET USED FOR FORMING QUINARY SUPERCONDUCTIVE OXIDE
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Patent #:
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Issue Dt:
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09/17/1991
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Application #:
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07399553
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Filing Dt:
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08/09/1989
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Title:
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TARGET MEMBER USED FOR FORMATION OF SUPERCONDUCTING FILM
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Patent #:
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Issue Dt:
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12/24/1991
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Application #:
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07415215
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Filing Dt:
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08/24/1989
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Title:
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PROCESS OF FORMING SUPERCONDUCTIVE WIRING STRIP
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Patent #:
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Issue Dt:
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05/28/1991
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Application #:
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07415355
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Filing Dt:
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08/18/1989
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Title:
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STRUCTURE OF SUPERCONDUCTIVE WIRING HAVING SIALON BUFFER LAYER THEREUNDER
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Patent #:
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Issue Dt:
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03/17/1992
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Application #:
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07474904
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Filing Dt:
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02/05/1990
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Title:
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SUBSTRATE USED FOR FABRICATION OF THICK FILM CIRCUIT
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Patent #:
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Issue Dt:
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02/11/1992
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Application #:
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07524936
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Filing Dt:
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05/18/1990
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Title:
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SUBSTRATE USED FOR FABRICATION OF THICK FILM CIRCUIT
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Patent #:
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Issue Dt:
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07/14/1992
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Application #:
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07594596
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Filing Dt:
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10/09/1990
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Title:
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CERAMIC SUBSTRATE USED FOR FABRICATING ELECTRIC OR ELECTRONIC CIRCUIT
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Assignee
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| 6-1, OTEMACHI 1-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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SUGHRUE, MION, ZINN, MACPEAK & SEAS
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2100 PENNSYLVANIA AVENUE, N.W.
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WASHINGTON, DC 20037-3202
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