Patent Assignment Details
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| Reel/Frame: | 005752/0135 | |
| Pages: | 3 |
| | Recorded: | 04/29/1991 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/09/1993
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Application #:
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07693979
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Filing Dt:
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04/29/1991
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Title:
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SUB-LAYER CONTACT TECHNIQUE USING IN SITU DOPED AMORPHOUS SILICON AND SOLID PHASE RECRYSTALLIZATION
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Correspondence name and address
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JEFFREY S. LABAW
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IBM CORPORATION
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FSD HQ-MAIL STOP 201
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6600 ROCKLEDGE DR.
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BETHESDA, MD 20817
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