Patent Assignment Details
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| Reel/Frame: | 005764/0173 | |
| Pages: | 3 |
| | Recorded: | 07/08/1991 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/25/1993
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Application #:
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07726457
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Filing Dt:
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07/08/1991
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Title:
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LEAD FRAME FOR SEMICONDUCTOR DEVICES HAVING IMPROVED ADHESIVE BOND LINE CONTROL
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Assignee
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| A CORPORATION OF DE |
| 2805 E. COLUMBIA ROAD |
| BOISE, IDAHO 83706 |
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Correspondence name and address
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MICRON TECHNOLOGY, INC.
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DAVID J. PAUL, PATENT AGENT
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2805 EAST COLUMBIA RD.
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BOISE, ID 83706
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