Patent Assignment Details
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| Reel/Frame: | 005791/0725 | |
| Pages: | 2 |
| | Recorded: | 08/07/1991 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/06/1993
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Application #:
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07715068
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Filing Dt:
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06/13/1991
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Title:
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PACKAGE HAVING A STRUCTURE FOR STABILIZING AND/OR IMPEDANCE-MATCHING A SEMICONDUCTOR IC DEVICE ACCOMMODATED THEREIN
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Assignees
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| 6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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| 20-1, JOUSUIHONCHO 5-CHOME, KODAIRA-SHI |
| TOKYO, JAPAN |
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Correspondence name and address
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PENNIE & EDMONDS
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1155 AVE. OF THE AMERICAS
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NEW YORK, NY 10036-2711
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