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Reel/Frame:005849/0586   Pages: 5
Recorded: 09/10/1991
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST.
Total properties: 1
1
Patent #:
5925443
Issue Dt:
07/20/1999
Application #:
07758991
Filing Dt:
09/10/1991
Title:
COPPER-BASED PASTE CONTAINING COPPER ALUMINATE FOR MICROSTRUCTURAL AND SHRINKAGE CONTROL OF COPPER-FILLED VIAS
Assignors
1
AOUDE, FARID Y.
Exec Dt:
09/04/1991
2
DAVID, LAWRENCE D.
Exec Dt:
09/03/1991
3
DIVAKARUNI, RENUKA S.
Exec Dt:
09/06/1991
4
FAROOQ, SHAJI
Exec Dt:
09/03/1991
5
HERRON, LESTER W.
Exec Dt:
09/04/1991
6
LASKY, HAL M.
Exec Dt:
09/03/1991
7
MASTREANI, ANTHONY
Exec Dt:
09/04/1991
8
NATARAJAN, GOVINDARAJAN
Exec Dt:
09/03/1991
9
REDDY, SRINIVASA S. N.
Exec Dt:
09/03/1991
10
SURA, VIVEK M.
Exec Dt:
09/03/1991
11
VALLABHANENI, RAO V.
Exec Dt:
09/03/1991
12
WALL, DONALD R.
Exec Dt:
09/03/1991
Assignee
1
INTERNATIONAL BUSINESS MACHINES CORPORATION A CORP. OF NEW YORK
ARMONK, NEW YORK 10504
Correspondence name and address
IRA DAVID BLECKER
INTELLECTUAL PROPERTY LAW, IBM CORP.
DEPT. 901, BLDG 300-482, ROUTE 52
HOPEWELL JUNCTION, NY 12533

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