Patent Assignment Details
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Reel/Frame: | 005887/0141 | |
| Pages: | 4 |
| | Recorded: | 10/24/1991 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/15/1994
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Application #:
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07729226
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Filing Dt:
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07/12/1991
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Title:
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CLAD BONDING WIRE FOR SEMICONDUCTOR DEVICE
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Assignee
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A CORPORATION OF JAPAN |
6-6 NIHONBASHI KAYABA-CHO 2-CHOME, CHUOH-KU |
TOKYO, JAPAN |
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Correspondence name and address
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SANDLER, GREENBLUM & BERNSTEIN
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2920 SOUTH GLEBE ROAD
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ARLINGTON, VA 22206
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