Patent Assignment Details
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Reel/Frame: | 005896/0947 | |
| Pages: | 2 |
| | Recorded: | 10/23/1991 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/21/1993
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Application #:
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07763214
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Filing Dt:
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09/20/1991
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Title:
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DIE BONDING APPARATUS AND METHOD OF CONTROLLING THE SAME
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Assignee
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2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU |
TOKYO, JAPAN |
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Correspondence name and address
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LEYDIG, VOIT & MAYER
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700 13TH ST., N.W., STE. 300
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WASHINGTON, DC 20005
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