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Patent Assignment Details
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Reel/Frame:006066/0142   Pages: 6
Recorded: 03/31/1992
Conveyance: SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 3
1
Patent #:
Issue Dt:
09/03/1991
Application #:
07629246
Filing Dt:
12/18/1990
Title:
PROCESS FOR THE PRODUCTION OF SEMIPROCESSED NON ORIENTED GRAIN ELECTRICAL STEEL
2
Patent #:
Issue Dt:
06/01/1993
Application #:
07629731
Filing Dt:
12/17/1990
Title:
METHOD OF ASSEMBLING INTEGRATED CIRCUITS TO A SILICON CIRCUIT BOARD
3
Patent #:
Issue Dt:
07/28/1992
Application #:
07630469
Filing Dt:
12/17/1990
Title:
MULTICHIP MODULE HAVING INTEGRAL DECOUPLING CAPACITOR
Assignor
1
Exec Dt:
03/31/1992
Assignee
1
Correspondence name and address
COMDISCO, INC.
ATTN: KENNETH E. GARSTKA
6111 NORTH RIVER ROAD
ROSENMONT, IL 60018

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