Patent Assignment Details
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| Reel/Frame: | 006121/0775 | |
| Pages: | 4 |
| | Recorded: | 05/18/1992 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/30/1993
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Application #:
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07828458
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Filing Dt:
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01/31/1992
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Title:
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METHOD FOR FORMING A PLANARIZED COMPOSITE METAL LAYER IN A SEMICONDUCTOR DEVICE
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Assignee
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| 416, MAETAN-DONG, KWONSUN-KU |
| SUWON, KYUNGGI-DO, REP. OF, KOREA, REPUBLIC OF |
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Correspondence name and address
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SAMSUNG ELECTRONICS
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STE. 250, ONE WESTIN CENTER
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2445 M ST., NW
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WASHINGTON, DC 20037
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