Patent Assignment Details
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| Reel/Frame: | 006140/0857 | |
| Pages: | 3 |
| | Recorded: | 05/28/1992 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/07/1993
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Application #:
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07843220
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Filing Dt:
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02/28/1992
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Title:
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METHOD OF DIE BONDING SEMICONDUCTOR CHIP
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Assignee
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| 2-3, MARUNOUCHI 2-CHOME |
| CHIYODA-KU, TOKYO, JAPAN |
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Correspondence name and address
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JEFFREY A. WYAND
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LEYDIG, VOIT & MAYER
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STE. 300
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700 THIRTEENTH STREET, N.W.
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WASHINGTON, DC 20005
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