Patent Assignment Details
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| Reel/Frame: | 006228/0625 | |
| Pages: | 2 |
| | Recorded: | 07/22/1992 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/06/1994
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Application #:
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07918816
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Filing Dt:
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07/22/1992
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Title:
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PACKAGE STRUCTURE AND METHOD FOR REDUCING BOND WIRE INDUCTANCE
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Assignee
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| 1109 MCKAY DRIVE |
| SAN JOSE, CALIFORNIA 95131 |
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Correspondence name and address
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VLSI TECHNOLOGY, INC.
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PAUL L. HICKMAN
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LEGAL DEPARTMENT
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1109 MCKAY DRIVE
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SAN JOSE, CALIFORNIA 95131
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