Patent Assignment Details
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Reel/Frame: | 006235/0908 | |
| Pages: | 4 |
| | Recorded: | 08/20/1992 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/02/1993
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Application #:
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07933433
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Filing Dt:
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08/20/1992
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Title:
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METHOD OF FORMING LOCAL ETCH STOP LANDING PADS FOR SIMULTANEOUS, SELF- ALIGNED DRY ETCHING OF CONTACT VIAS WITH VARIOUS DEPTHS
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Assignee
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A CORP. OF DE |
2805 E. COLUMBIA ROAD |
BOISE, IDAHO 83706 |
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Correspondence name and address
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MICRON SEMICONDUCTOR, INC.
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DAVID J. PAUL, PATENT AGENT
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2805 EAST COLUMBIA RD.
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BOISE, ID 83706
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