Patent Assignment Details
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| Reel/Frame: | 006250/0784 | |
| Pages: | 2 |
| | Recorded: | 09/09/1992 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/30/1993
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Application #:
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07942235
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Filing Dt:
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09/09/1992
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Title:
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METHOD OF DICING SEMICONDUCTOR WAFER WITH DIAMOND AND RESIN BLADES
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Assignee
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| 1015, KAMIKODANAKA, NAKAHARA-KU, KAWASAKI-SHI, |
| KANAGWA 211, JAPAN |
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Correspondence name and address
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NIKAIDO, MARMELSTEIN, MURRAY & ORAM
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655 15TH STREET, N.W.W G ST. LOBBY
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METROPOLITAN SQUARE, STE. 330
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WASHINGTON, D.C. 20005
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ATTN: GEORGE E. ORAM, JR.
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