Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 006271/0434 | |
| Pages: | 2 |
| | Recorded: | 10/05/1992 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/31/1993
|
Application #:
|
07936271
|
Filing Dt:
|
08/27/1992
|
|
Title:
|
METHOD FOR ELECTROPLATING THE LEAD PINS OF A SEMICONDUCTOR DEVICE PIN GRID ARRAY PACKAGE
|
|
|
Assignee
|
|
|
|
|
| 7-1, SHIBA 5-CHOME |
| MINATO-KU, TOKYO, JAPAN |
|
|
Correspondence name and address
|
| |
SAMSON HELFGOTT
|
| |
HELFGOTT & KARAS, P.C.
|
| |
DOCKET NO.: NEKS 10.860
|
| |
350 FIFTH AVENUE, 60TH FLOOR
|
| |
NEW YORK, NY 10118
|
Search Results as of:
05/13/2024 11:58 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
