Patent Assignment Details
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| Reel/Frame: | 006287/0336 | |
| Pages: | 4 |
| | Recorded: | 10/05/1992 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/22/1993
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Application #:
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07956236
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Filing Dt:
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10/05/1992
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Title:
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METHOD FOR FORMING TIN-INDIUM OR TIN-BISMUTH SOLDER CONNECTION HAVING INCREASED MELTING TEMPERATURE
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Assignee
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| CORPORATE OFFICES, 1303 E. ALGONQUIN ROAD |
| INTELLECTUAL PROPERTY DEPARTMENT |
| SCHAUMBURG, ILLINOIS 60196 |
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Correspondence name and address
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MOTOROLA INC.
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CORPORATE OFFICE
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INTELLECTUAL PROPERTY DEPARTMENT
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1303 E. ALGONQUIN ROAD
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SCHAUMBURG, IL 60196
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