Patent Assignment Details
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| Reel/Frame: | 006536/0986 | |
| Pages: | 4 |
| | Recorded: | 05/13/1993 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/25/1997
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Application #:
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08060902
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Filing Dt:
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05/13/1993
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Title:
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IN SITU ETCH PROCESS FOR INSULATING AND CONDUCTIVE MATERIALS
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Assignee
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| MAIL STOP 507 PATENT DEPARTMENT |
| 2805 E. COLUMBIA ROAD |
| BOISE, IDAHO 83706 |
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Correspondence name and address
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LIA M. PAPPAS
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MAIL STOP 507
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PATENT DEPARTMENT
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2805 E. COLUMBIA ROAD
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BOISE, ID 83706
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