Patent Assignment Details
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| Reel/Frame: | 006550/0771 | |
| Pages: | 6 |
| | Recorded: | 05/03/1993 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/28/1994
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Application #:
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08055589
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Filing Dt:
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05/03/1993
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Title:
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METHOD AND APPARATUS FOR USE IN FORMING PRE-POSITIONED SOLDER BUMPS ON A PAD ARRANGEMENT
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Assignee
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| 1303 E. ALGONQUIN ROAD |
| SCHAUMBURG, ILLINOIS 60196 |
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Correspondence name and address
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PHILIP P. MACNAK
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MOTOROLA, INC.
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IP LAW DEPARTMENT-MS96
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1500 NW 22ND AVENUE
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BOYNTON BEACH, FL 33426-8292
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