Patent Assignment Details
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Reel/Frame: | 006564/0964 | |
| Pages: | 3 |
| | Recorded: | 05/17/1993 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/13/1994
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Application #:
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08062674
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Filing Dt:
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05/17/1993
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Title:
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POWDER FOR THE MODIFICATION OF THERMOPLASTIC RESINS
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Assignee
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MITSUI BUILDING NO. 6, 3-16 |
2-CHOME, NIHONBASHI-MUROMACHI |
CHUO-KU, TOKYO 103, JAPAN |
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Correspondence name and address
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DOW CORNING CORPORATION
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ALEXANDER WEITZ
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PATENT DEPARTMENT MAIL-CO1232
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P.O. BOX 0994
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MIDLAND, MI 48686
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