Patent Assignment Details
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| Reel/Frame: | 006571/0250 | |
| Pages: | 2 |
| | Recorded: | 05/04/1993 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/04/1995
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Application #:
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08056488
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Filing Dt:
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05/04/1993
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Title:
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PLATING DEVICE FOR WAFER
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Assignee
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| 6-6, NIHOMBASHI-KAYABACHO 2-CHOME |
| CHUO-KU, TOKYO, JAPAN |
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Correspondence name and address
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MICHAEL D. BEDNAREK
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SUITE 750
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2001 L STREET, N.W.
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WASHINGTON, D.C. 20036
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