Patent Assignment Details
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| Reel/Frame: | 006626/0726 | |
| Pages: | 4 |
| | Recorded: | 05/06/1993 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/12/1997
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Application #:
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08059003
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Filing Dt:
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05/06/1993
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Title:
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SOLDER INTERCONNECTION STRUCTURE
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Assignee
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| OLD ORCHARD ROAD ARMONK, NY 10504 |
| ARMONK,, NEW YORK 10504 |
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Correspondence name and address
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IBM CORPORATION
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RICHARD M. TOLDMAN
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INTELLECTUAL PROPERTY LAW
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N50/251-2
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ENDICOTT, NY 13760
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