Patent Assignment Details
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| Reel/Frame: | 006637/0573 | |
| Pages: | 3 |
| | Recorded: | 07/22/1993 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/31/1995
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Application #:
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08094735
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Filing Dt:
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07/22/1993
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Title:
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SEMICONDUCTOR CHIP BONDED TO A SUBSTRATE AND METHOD OF MAKING
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Assignee
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| 1303 EAST ALGONQUIN ROAD |
| SCHAUMBURG, ILLINOIS 60196 |
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Correspondence name and address
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MOTOROLA, INC.
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MIRIAM JACKSON
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INTELLECTUAL PROPERTY DEPT.
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SUITE R3108 - P.O. BOX 10219
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SCOTTSDALE, ARIZONA 85271-0219
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