Patent Assignment Details
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| Reel/Frame: | 006645/0669 | |
| Pages: | 3 |
| | Recorded: | 07/22/1993 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/25/1995
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Application #:
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08079737
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Filing Dt:
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06/22/1993
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Title:
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HIGH DENSITY SEMICONDUCTOR DEVICE HAVING INCLINED CHIP MOUNTING
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Assignee
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| 2-3, MARUNOUCHI 2-CHOME CHIYODA-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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LEYDIG, VOIT & MAYER
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700 THIRTEENTH STREET, N.W., SUITE 300
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WASHINGTON, D.C. 20005
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