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Reel/Frame:006666/0846   Pages: 2
Recorded: 03/17/1993
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
01/31/1995
Application #:
08030356
Filing Dt:
03/17/1993
Title:
SEMICONDUCTOR WAFER HEAT TREATMENT METHOD
Assignors
1
Exec Dt:
03/04/1993
2
Exec Dt:
03/09/1993
3
Exec Dt:
03/09/1993
Assignee
1
KANAGAWA, JAPAN
JAPAN
Correspondence name and address
GERALD T. SHEKLETON
WELSH & KATZ, LTD.
135 S. LASALLE STREET
SUITE 1625
CHICAGO, IL 60603

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