Patent Assignment Details
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| Reel/Frame: | 006669/0152 | |
| Pages: | 2 |
| | Recorded: | 08/13/1993 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/25/1994
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Application #:
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08106026
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Filing Dt:
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08/13/1993
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Title:
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METHOD AND SYSTEM FOR FABRICATING IC PACKAGES FROM LAMINATED BOARDS AND HEAT SPREADER
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Assignee
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| 1551 MCCARTHY BLVD. M/S D-106 |
| MILPITAS, CALIFORNIA 95035 |
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Correspondence name and address
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SID LEACH
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HONIGMAN, MILLER, SCHWARTZ AND COHN
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3100 FIRST INTERSTATE BANK PLAZA
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1000 LOUISIANA
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HOUSTON, TX 77002-5011
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