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Patent Assignment Details
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Reel/Frame:006672/0466   Pages: 2
Recorded: 08/18/1993
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
05/30/1995
Application #:
08110281
Filing Dt:
08/18/1993
Title:
SYSTEM FOR ENCAPSULATING AN INTEGRATED CIRCUIT PACKAGE
Assignor
1
Exec Dt:
08/17/1993
Assignee
1
1551 MCCARTHY BLVD.
MILPITAS, CALIFORNIA 95035
Correspondence name and address
SID LEACH, ESQ.
HONIGMAN, MILLER, SCHWARTZ AND COHN
3100 FIRST INTERSTATE BANK PLAZA
1000 LOUISIANA STREET
HOUSTON, TX 77002-5011

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