Patent Assignment Details
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| Reel/Frame: | 006694/0161 | |
| Pages: | 5 |
| | Recorded: | 08/30/1993 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/14/1995
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Application #:
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08069640
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Filing Dt:
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06/01/1993
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Title:
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TIN BISMUTH SOLDER PASTE, AND METHOD USING PASTE TO FORM CONNECTION HAVING IMPROVED HIGH TEMPERATURE PROPERTIES
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Assignee
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| CORPORATE OFFICES, INTELLECTUAL PROPERTY DEPARTMENT, 1303 E. ALONGQUIN ROAD |
| SCHAUMBURG, ILLINOIS 60196 |
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Correspondence name and address
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MOTOROLA, INC.
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DOUGLAS D. FEKETE
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INTELLECTUAL PROPERTY DEPT.
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1303 E. ALGONQUIN RD., CORPORATE OFFICES
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SCHAUMBURG, IL 60196
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