Patent Assignment Details
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| Reel/Frame: | 006699/0579 | |
| Pages: | 3 |
| | Recorded: | 09/16/1993 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/27/1994
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Application #:
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08121554
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Filing Dt:
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09/16/1993
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Title:
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METHOD OF MANUFACTURING A SEMICONDUCTOR IC DEVICE HAVING MULTILAYER INTERCONNECTION STRUCTURE
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Assignee
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| 72 HORIKAWA-CHO |
| SAIWAI-KU, KAWASAKI-SHI, JAPAN |
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Correspondence name and address
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MR. JOHN B. TURNER
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MANAGER, FILING AND PROSECUTION DEPT.
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FINNEGAN, HENDERSON, FARABOW ET AL.
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1300 I STREET, N.W.
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WASHINGTON, D.C. 20005
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