Patent Assignment Details
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Reel/Frame: | 006705/0220 | |
| Pages: | 4 |
| | Recorded: | 09/21/1993 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/26/1995
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Application #:
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08102146
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Filing Dt:
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08/04/1993
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Title:
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BONDED AND ENCAPSULATED THREE DIMENSIONAL HYBRID INTEGRATED CIRCUIT MODULES
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Assignee
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POSTFACH 801109 |
81663 MUNCHEN, GERMANY |
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Correspondence name and address
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MCGLEW & TUTTLE, P.C.
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JOHN JAMES MCGLEW
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SCARBOROUGH STATION
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SCARBOROUGH, NEW YORK 10510-0827
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