Patent Assignment Details
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| Reel/Frame: | 006742/0158 | |
| Pages: | 3 |
| | Recorded: | 10/04/1993 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/25/1995
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Application #:
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08130830
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Filing Dt:
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10/04/1993
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Title:
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MICROELECTRONIC PACKAGE COMPRISING TIN-COPPER SOLDER BUMP INTERCONNECTIONS, AND METHOD FOR FORMING SAME
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Assignee
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| 1303 E. ALGONQUIN ROAD |
| CORPORATE OFFICES INTELLECTUAL PROPERTY DEPARTMENT |
| SCHAUMBURG, ILLINOIS 60196 |
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Correspondence name and address
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MOTOROLA, INC.
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DOUGLAS D. FEKETE
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CORPORATE OFFICES, INTELLECTUAL PROPERTY
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DEPT., 1303 E. ALGONQUIN ROAD
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SCHAUMBURG, IL 60196
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