Patent Assignment Details
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| Reel/Frame: | 006776/0304 | |
| Pages: | 3 |
| | Recorded: | 11/10/1993 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/02/1996
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Application #:
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08149855
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Filing Dt:
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11/10/1993
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Title:
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SYSTEM FOR COMPENSATING AGAINST WAFER EDGE HEAT LOSS IN RAPID THERMAL PROCESSING
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Assignee
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| PATENT DEPT., MS 507 |
| 2805 E. COLUMBIA ROAD |
| BOISE, IDAHO 83706 |
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Correspondence name and address
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DAVID J. PAUL
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MICRON SEMICONDUCTOR, INC.
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PATENT DEPT., MS 507
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2805 E. COLUMBIA ROAD
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BOISE, ID 83706
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