Patent Assignment Details
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| Reel/Frame: | 006803/0861 | |
| Pages: | 2 |
| | Recorded: | 12/09/1993 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/21/1995
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Application #:
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08164342
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Filing Dt:
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12/09/1993
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Title:
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METHOD FOR INCREASING PAD BONDING OF AN IC (1)
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Assignee
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| NO. 3, INDUSTRY E. ROAD III |
| SCIENCE-BASED INDUSTRIAL PARK HSINCHU CITY TAIWAN, R.O.C. |
| HSINCHU CITY TAIWAN,, TAIWAN |
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Correspondence name and address
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LADAS & PARRY
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RICHARD P. BERG, ESQ.
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5670 WILSHIRE BOULEVARD
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SUITE 2100
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LOS ANGELES, CA 90036
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