Patent Assignment Details
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| Reel/Frame: | 006840/0759 | |
| Pages: | 3 |
| | Recorded: | 12/30/1993 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/26/1995
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Application #:
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08175629
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Filing Dt:
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12/30/1993
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Title:
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METHOD OF ETCHING SEMICONDUCTOR SUBSTRATE
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Assignee
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| 1-1 SAIWAI-CHO, TAKATSUKI-SHI |
| OSAKA, JAPAN 569 |
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Correspondence name and address
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WILLIAN BRINKS HOFER GILSON & LIONE
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KENNETH L. CAGE, ESQ.
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2000 K STREET, N.W.
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SUITE 200
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WASHINGTON, D.C. 20006-1809
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