Patent Assignment Details
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| Reel/Frame: | 006966/0716 | |
| Pages: | 4 |
| | Recorded: | 04/18/1994 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/17/1996
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Application #:
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08228654
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Filing Dt:
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04/18/1994
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Title:
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IC CHIP FOR DIFFERENT TYPE IC PACKAGES
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Assignee
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| 5-5, KEIHAN-HONDORI 2-CHOME |
| MORIGUCHI-CITY |
| OSAKA, JAPAN |
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Correspondence name and address
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JOSEPH B. LERCH
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DARBY & DARBY P.C.
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805 THIRD AVENUE
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27TH FLOOR
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NEW YORK, NY 10022-7513
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