Patent Assignment Details
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Reel/Frame: | 006977/0570 | |
| Pages: | 2 |
| | Recorded: | 04/21/1994 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/23/1996
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Application #:
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08230673
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Filing Dt:
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04/21/1994
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Title:
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METHOD FOR BONDING SUBSTRATES WITH SILICONE RUBBER COMPRISING BOTH A THERMAL AND MOISTURE CROSSLINKING COMPONENT
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Assignee
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3-16, 2-CHOME, NIHONBASHI-MUROMACHI, |
MITSUI BUILDING NO. 6 |
CHUO-KU, TOKYO 103, JAPAN |
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Correspondence name and address
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DOW CORNING CORPORATION
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ROGER H. BORROUSCH
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PATENT DEPARTMENT MAIL-C01232
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P.O. BOX 0994
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MIDLAND, MI 48686
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