Patent Assignment Details
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Reel/Frame: | 006978/0146 | |
| Pages: | 4 |
| | Recorded: | 04/26/1994 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/23/1996
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Application #:
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08233460
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Filing Dt:
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04/26/1994
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Title:
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LEAD FRAME MATERIAL AND LEAD FRAME FOR SEMICONDUCTOR DEVICE
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Assignee
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6-2, GINZA 1-CHOME, CHUO-KU, |
TOKYO, JAPAN |
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Correspondence name and address
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JEFFREY J. SOPKO
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PEARNE, GORDON, MCCOY & GRANGER
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1200 LEADER BUILDING
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CLEVELAND, OH 44114
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