Patent Assignment Details
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| Reel/Frame: | 006984/0076 | |
| Pages: | 2 |
| | Recorded: | 05/16/1994 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/06/1998
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Application #:
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08227385
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Filing Dt:
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04/14/1994
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Title:
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PACKAGING STRUCTURE FOR A HERMETICALLY SEALED FLIP CHIP SEMICONDUCTOR DEVICE
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Assignee
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| 7-1, SHIBA 5-CHOME MINATO-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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J. FRANK OSHA
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SUGHRUE, MION, ZINN, MACPEAK & SEAS
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2100 PENNSYLVANIA AVENUE, N.W., STE. 800
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WASHINGTON, DC 20037-3202
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