Patent Assignment Details
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| Reel/Frame: | 006987/0227 | |
| Pages: | 4 |
| | Recorded: | 04/12/1994 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/14/1999
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Application #:
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08226539
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Filing Dt:
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04/12/1994
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Title:
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EPOXY GROUP-CONTAINING SILICONE RESIN AND COMPOSITIONS BASED THEREON
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Assignee
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| MITSUI BUILDING NO. 6, 3-16 2-CHOME, |
| NIHONBASHI-MUROMACHI, CHUO-KU |
| TOKYO 103, JAPAN |
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Correspondence name and address
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DOW CORNING CORPORATION
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ALEXANDER WEITZ
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PATENT DEPARTMENT MAIL-C01232
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P.O. BOX 0994
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MIDLAND, MI 48686
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