Patent Assignment Details
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Reel/Frame: | 007016/0865 | |
| Pages: | 3 |
| | Recorded: | 05/26/1994 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/02/1996
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Application #:
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08249737
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Filing Dt:
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05/26/1994
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Title:
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HYBRID INTEGRATED CIRCUIT DEVICE WITH HEAT SUPPRESSION MEANS PROVIDED IN THE VICINITY OF SOLDER BONDING AREAS
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Assignee
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2-3, MARUNOUCHI 2-CHOME |
CHIYODA-KU, TOKYO, JAPAN 100 |
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Correspondence name and address
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LEYDIG, VOIT & MAYER
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JEFFREY A. WYAND
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SUITE 300
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700 THIRTEENTH STREET, NW
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WASHINGTON, DC 20005
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