Patent Assignment Details
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Reel/Frame: | 007021/0697 | |
| Pages: | 3 |
| | Recorded: | 05/27/1994 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/27/1996
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Application #:
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08250503
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Filing Dt:
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05/27/1994
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Title:
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METHOD OF MAKING SEMICONDUCTOR WAFERS
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Assignee
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4-2, MARUNOUCHI |
TOKYO, JAPAN |
1-CHOME CHIYODA-KU TOKYO, JAPAN |
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Correspondence name and address
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WHITHAM, CURTIS & WHITHAM
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11800 SUNRISE VALLEY DRIVE
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SUITE 220
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RESTON, VA 22091
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ATTN: JOYCE KEEN
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