Patent Assignment Details
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| Reel/Frame: | 007050/0914 | |
| Pages: | 3 |
| | Recorded: | 07/01/1994 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/02/2001
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Application #:
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08234073
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Filing Dt:
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04/28/1994
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Title:
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PROCESS FOR PREPARING A SEMICONDUCTOR WAFER
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Assignee
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| 23-23-HONCHO, ITABASHI-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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WILLIAM E. HILLER
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TEXAS INSTRUMENTS INCORPORATED
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P.O. BOX 655474, M/S 219
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DALLAS, TEXAS 75265
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