Patent Assignment Details
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| Reel/Frame: | 007063/0392 | |
| Pages: | 4 |
| | Recorded: | 06/24/1994 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/30/1996
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Application #:
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08222899
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Filing Dt:
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04/05/1994
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Title:
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MASKING OF CIRCUIT BOARD VIAS TO REDUCE HEAT-INDUCED BOARD AND CHIP CARRIER PACKAGE WARP DURING WAVESOLDER PROCESS
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Assignee
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| 20555 SH 249, BLDG. CCA |
| HOUSTON, TEXAS 77070 |
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Correspondence name and address
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LESTER L. HEWITT
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PRAVEL, HEWITT, KIMBALL ET AL.
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1177 WEST LOOP SOUTH, 10TH FLOOR
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HOUSTON, TX 77027-9095
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