Patent Assignment Details
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| Reel/Frame: | 007119/0126 | |
| Pages: | 2 |
| | Recorded: | 09/02/1994 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/19/1987
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Application #:
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06770275
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Filing Dt:
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08/28/1985
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Title:
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METHOD FOR PLANARIZING MULTILAYER SEMICONDUCTOR DEVICES
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Assignee
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| PATENT DEPARTMENT |
| MAIL STOP 507 2805 E. COLUMBIA ROAD |
| BOISE, IDAHO 83706 |
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Correspondence name and address
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LIA M. PAPPAS
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MICRON SEMICONDUCTOR, INC.
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PATENT DEPARTMENT, MS 507
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2805 E. COLUMBIA ROAD
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BOISE, ID 83706
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