Patent Assignment Details
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| Reel/Frame: | 007132/0211 | |
| Pages: | 3 |
| | Recorded: | 09/15/1994 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/18/1997
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Application #:
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08229232
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Filing Dt:
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04/18/1994
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Title:
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METHOD OF MOLDING RESIN TO SEAL ELECTRONIC PARTS USING TWO EVACUATION STEPS
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Assignee
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| 122-2, MEGAWA, MAKISHIMA-CHO, UJI-SHI |
| KYOTO, JAPAN |
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Correspondence name and address
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W. G. FASSE
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P.O. BOX K
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ST. ALBANS, ME 04971
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