Patent Assignment Details
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| Reel/Frame: | 007137/0171 | |
| Pages: | 2 |
| | Recorded: | 09/06/1994 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/09/1995
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Application #:
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08301186
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Filing Dt:
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09/06/1994
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Title:
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LID FOR SEMICONDUCTOR PACKAGE AND PACKAGE HAVING THE LID
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Assignee
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| 2701-1, AZA IWAKURA, HIGASHIBUN, OHMINE-CHO MINE-S |
| YAMAGUCHI, JAPAN |
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Correspondence name and address
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FLYNN, THIEL, BOUTELL & TANIS P.C.
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2026 RAMBLING ROAD
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KALAMAZOO, MI 49008-1699
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ATTN: TERRYENCE F. CHAPMAN
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