Patent Assignment Details
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| Reel/Frame: | 007137/0345 | |
| Pages: | 2 |
| | Recorded: | 04/28/1994 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/16/1996
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Application #:
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08232198
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Filing Dt:
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04/28/1994
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Title:
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APPARATUS FOR AND METHOD OF MANUFACTURING SEMICONDUCTOR WAFER
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Assignee
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| 2612 SHINOMIYA, HIRATSUKA-SHI |
| KANAGAWA 254, JAPAN |
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Correspondence name and address
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GERALD T. SHEKLETON, ESQ.
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WELSH & KATZ, LTD.
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135 S. LASALLE, ST-SUITE 1625
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CHICAGO, IL 60603
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