Patent Assignment Details
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Reel/Frame: | 007155/0817 | |
| Pages: | 5 |
| | Recorded: | 09/14/1994 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/10/1996
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Application #:
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08306024
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Filing Dt:
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09/14/1994
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Title:
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ADHESION ENHANCED SEMICONDUCTOR DIE FOR MOLD COMPOUND PACKAGING
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Assignee
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2805 E. COLUMBIA RD. BOISE, ID 83706 |
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Correspondence name and address
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HOPKINS, RODEN, CROCKETT, HANSEN &
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HOOPES
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LANE R. SIMMONS
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428 PARK AVE., P.O. BOX 51219
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IDAHO FALLS, ID 83405-1219
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