Patent Assignment Details
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| Reel/Frame: | 007191/0388 | |
| Pages: | 3 |
| | Recorded: | 10/11/1994 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/12/1996
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Application #:
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08321643
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Filing Dt:
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10/11/1994
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Title:
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METHOD FOR POSITIONING BOND PADS IN A SEMICONDUCTOR DIE LAYOUT
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Assignee
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| 1303 EAST ALGONQUIN ROAD |
| SCHAUMBURG,, ILLINOIS 60196 |
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Correspondence name and address
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MOTOROLA, INC.
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INTELLECTUAL PROPERTY DEPT.
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505 BARTON SPRINGS RD.
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SUITE 500, AUSTIN, TX 78704
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ATTN: PATRICIA S. GODDARD
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